| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K9F1G08UOC-PCBO | SAMSUNG/三星 | TSSOP48 | 024+ | 245 | 2026-06-27 | |||
| MBM29F800TA-70PFTN | FUJITSU/富士通 | TSOP | 0534+ | 484 | 2026-06-27 | |||
| AT49BV322D-70TU | ATMEL/爱特梅尔 | TSSOP48 | 1030+ | 534 | 2026-06-27 | |||
| SIL3132CNU | SILLCON | QFN | 0827+ | 289 | 2026-06-27 | |||
| SST39VF800A70-4C-E | SST/超捷 | TSSOP48 | 1037+ | 293 | 2026-06-27 | |||
| HD61202 | HITACHI/日立 | QFP | 15+ | 3390 | 2026-06-27 | |||
| HY57V641620FTP-7 | XILINX/赛灵思 | TSOP54 | 1128+ | 303 | 2026-06-27 | |||
| TEA6845H | NXP/恩智浦 | QFP | 04+ | 217 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DS1307Z | MAXIM/美信 | SOP8 | 2221+ | 300 | 2026-06-27 | |||
| T6A40 | TOSHIBA/东芝 | QFP92 | 05+ | 381 | 2026-06-27 | |||
| L9942XP1TR | ST/意法 | SOP | 21+ | 511 | 2026-06-27 | |||
| L6391DTR | ST/意法 | SOP | 2019+ | 441 | 2026-06-27 | |||
| AD22279-A-R2 | ADI/亚德诺 | 1523+ | 240 | 2026-06-27 | ||||
| MAX3244ECAI | MAXIM/美信 | SOP | 1612+ | 1024 | 2026-06-27 | |||
| RJP4002ANS | RENESAS/瑞萨 | VSON8 | 0326+ | 295 | 2026-06-27 | |||
| BCM5241A1KMLG | BROADCOM/博通 | QFN32 | 0937+ | 2500 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LTC2902-1CGN#TRPBF | LINEAR/凌特 | TSSOP16 | 0723+ | 2097 | 2026-06-27 | |||
| LT1790BCS6-2.5#TRPBF | LINEAR/凌特 | SOT23-6 | 0916+ | 2190 | 2026-06-27 | |||
| DRV103H | TI/德州仪器 | SOP8 | 12+ | 819 | 2026-06-27 | |||
| MAX823TEUK | MAXIM/美信 | SOT-23 | 09+ | 2500 | 2026-06-27 | |||
| MAX1616EUK+T | MAXIM/美信 | SOT-23 | 0748+ | 1577 | 2026-06-27 | |||
| NE555 | ST/意法 | SOP8 | 350 | 2026-06-27 | ||||
| TPS65910A3A1RSL | TI/德州仪器 | QFN48 | 2223+ | 210 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MIC5239-3.3YS | MICREL/麦瑞 | SOT-223 | 1118+ | 2500 | 2026-06-27 | |||
| BAV70 | NXP/恩智浦 | SOT-23 | 1110+ | 3000 | 2026-06-27 | |||
| IR2153D | INFINEON/英飞凌 | SIP8 | 335P | 821 | 2026-06-27 | |||
| MMBT3904 | LRC/乐山 | 530 | 2026-06-27 | |||||
| BC847C | NEXPERIA/安世 | SOT23 | 1720+ | 3000 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DAC7734E | BURR-BROWN | SSOP48 | 09+ | 200 | 2026-06-27 | |||
| DAC904U | BURR-BROWN | SOIC-28 | 09+ | 150 | 2026-06-27 | |||
| DAC712UB | BURR-BROWN | SOIC-28 | 09+ | 237 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| OP275GSZ-REEL | ADI/亚德诺 | SOP8 | 1605+ | 7500 | 2026-06-27 | |||
| LT1253CS8 | LINEAR/凌特 | SOIC-8 | 1126+ | 800 | 2026-06-27 | |||
| LM358P | TI/德州仪器 | DIP8 | 1628+ | 220 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UCC27201ADDAR | TI/德州仪器 | SOP8 | 2315+ | 290 | 2026-06-27 | |||
| 1723161108 | MOLEX/莫仕 | 22+ | 1170 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SMDA15C-5.TBT | SEMTECH/升特 | SOP8 | 1434+ | 500 | 2026-06-27 | |||
| PIC16LF721-I/SS | MICROCHIP/微芯 | SSOP20 | 2205+2213+ | 304 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| JS28F320C3BD70 | INTEL/英特尔 | TSOP | 08+ | 48 | 2026-06-27 | |||
| LT1121IS8-5 | LINEAR/凌特 | SOP8 | 1323+ | 3 | 2026-06-27 | |||
| LTC1064-3CSW | LINEAR/凌特 | SOP16 | 1323+ | 2 | 2026-06-27 | |||
| LT1008CS8 | LINEAR/凌特 | SOP8 | 1548+ | 10 | 2026-06-27 | |||
| AD7339BRZ | ADI/亚德诺 | SOP16 | 1420+ | 2 | 2026-06-27 | |||
| AD976ARZ | ADI/亚德诺 | SOP | 2127 | 12 | 2026-06-27 | |||
| AD333ABRSZ | ADI/亚德诺 | SOP20 | 1525+ | 8 | 2026-06-27 | |||
| AD9235BRUZ | ADI/亚德诺 | 1450+ | 10 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| M27C1001-12F1 | ST/意法 | DIP32 | 1602+ | 151 | 2026-06-27 | |||
| EP1K100QC208-1N | ALTERA/阿尔特拉 | QFP | 12+ | 3 | 2026-06-27 | |||
| VS1003B | VLSI | QFP48 | 13+ | 20 | 2026-06-27 | |||
| INA148UA | TI/德州仪器 | SOP8 | 2228+ | 21 | 2026-06-27 | |||
| XC17128EPC | XILINX/赛灵思 | DIP8 | 1015+ | 5 | 2026-06-27 | |||
| DS1620S | MAXIM/美信 | SOP8 | 2214+ | 40 | 2026-06-27 | |||
| LTC2614CGN | LINEAR/凌特 | SOP | 214+ | 1 | 2026-06-27 | |||
| EPF10K30RC240-4 | ALTERA/阿尔特拉 | 1725+ | 1 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AD588AQ | ADI/亚德诺 | DIP16 | 1839+ | 4 | 2026-06-27 | |||
| PIC18F27Q43-I/SO | MICROCHIP/微芯 | SOP28 | 2138+ | 30 | 2026-06-27 | |||
| PIC16LF721-I/SS | MICROCHIP/微芯 | SSOP20 | 2213+ | 19 | 2026-06-27 | |||
| PIC24FJ256GA106-I/PT | MICROCHIP/微芯 | QFP | 1436+ | 50 | 2026-06-27 | |||
| 74HCT540D | NXP/恩智浦 | SSOP20 | 0821+ | 50 | 2026-06-27 | |||
| AT89S52-24JU | ATMEL/爱特梅尔 | PLCC44 | 1626+ | 6 | 2026-06-27 | |||
| LTC1871EMS-7 | LINEAR/凌特 | MSOP10 | 09+ | 2 | 2026-06-27 | |||
| MAX1480ACPI | MAXIM/美信 | DIP28 | 1009+ | 2 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AD7899ARZ-1REEL | ADI/亚德诺 | SOP | 2205+ | 2 | 2026-06-27 | |||
| MAX1242ACSA | MAXIM/美信 | SOP8 | 2250+ | 22 | 2026-06-27 | |||
| ADS1240E | TI/德州仪器 | SOP | 2225+ | 37 | 2026-06-27 | |||
| ADS7800JU | BURR-BROWN | SOIC24 | 09+ | 160 | 2026-06-27 | |||
| ADS7824U | BURR-BROWN | SOIC-28 | 09+ | 69 | 2026-06-27 | |||
| DAC7725U | BURR-BROWN | SOIC-28 | 07+ | 34 | 2026-06-27 | |||
| DAC712U | BURR-BROWN | SOIC-28 | 09+ | 26 | 2026-06-27 | |||
| AD7863ARSZ-2 | ADI/亚德诺 | SSOP28 | 0721+ | 3761 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AM29LV040B-90JI | ADVANCED MICRO DEVICES | 5 | 2026-06-27 | |||||
| K6X8016T3B-TF55 | SAMSUNG/三星 | SOP | 2215+ | 10 | 2026-06-27 | |||
| W27C512-45Z | WINBOND/华邦 | DIP28 | 1923+ | 10 | 2026-06-27 | |||
| GAL22V10D-7LP | LATTICE/莱迪斯 | DIP24 | 135+ | 60 | 2026-06-27 | |||
| MC14490P | ONSEMI/安森美 | DIP8 | 1521+ | 50 | 2026-06-27 | |||
| M29F010B-70K1 | ST/意法 | PLCC32 | 10+ | 15 | 2026-06-27 | |||
| AT28C256-15PU | ATMEL/爱特梅尔 | DIP28 | 0923+ | 5 | 2026-06-27 | |||
| MT8816AE | ZARLINK | DIP40 | 1020+ | 25 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| INA117P | BURR-BROWN | DIP8 | 22+ | 5 | 2026-06-27 | |||
| OPA548T | BURR-BROWN | TO220 | 17+ | 5 | 2026-06-27 | |||
| INA103KU | BURR-BROWN | SOIC-16 | 09+ | 6 | 2026-06-27 | |||
| ISO124U | BURR-BROWN | SOIC-8 | 09+ | 9 | 2026-06-27 | |||
| OPA4277UA | BURR-BROWN | SOIC-14 | 09+ | 1 | 2026-06-27 | |||
| INA163UA | BURR-BROWN | SOIC-14 | 09+ | 92 | 2026-06-27 | |||
| OPA4131UA | BURR-BROWN | SOIC-16 | 09+ | 1 | 2026-06-27 | |||
| OPA2130UA | BURR-BROWN | SOIC-8 | 09+ | 1 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX807NCWE | MAXIM/美信 | SOP16 | 2212+ | 10 | 2026-06-27 | |||
| LM4041BIM3X-1.2 | NS/美国国半 | SOT-23 | 0825+ | 105 | 2026-06-27 | |||
| LNK304PN | POWER INTEGRATIONS/帕沃英蒂格盛 | DIP8 | 10+ | 86 | 2026-06-27 | |||
| LM2576HVT-ADJ | NS/美国国半 | TO220 | 10+ | 10 | 2026-06-27 | |||
| ICE3B0565 | INFINEON/英飞凌 | DIP8 | 10+ | 100 | 2026-06-27 | |||
| ICE3A2565 | INFINEON/英飞凌 | DIP8 | 0926+ | 2 | 2026-06-27 | |||
| TPS62160DGKR | TI/德州仪器 | MSOP8 | 2112+ | 15 | 2026-06-27 | |||
| TL7705ACP | TI/德州仪器 | DIP8 | 21+ | 30 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PCA9517DR | TI/德州仪器 | SOP8 | 22+ | 49 | 2026-06-27 | |||
| SN74LS245N | TI/德州仪器 | DIP20 | 17+ | 99 | 2026-06-27 | |||
| 74HC00N | TI/德州仪器 | DIP14 | 23+ | 688 | 2026-06-27 | |||
| SN74LS08N | TI/德州仪器 | DIP14 | 09+ | 9 | 2026-06-27 | |||
| SN74LS138N | TI/德州仪器 | DIP16 | 99+ | 1 | 2026-06-27 | |||
| SN75176BP | TI/德州仪器 | DIP8 | 09+ | 39 | 2026-06-27 | |||
| HCF4051BE | ST/意法 | DIP16 | 07+ | 5 | 2026-06-27 | |||
| SN74HC541N | TI/德州仪器 | DIP20 | 09+ | 4 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX3815CCM | MAXIM/美信 | QFN | 2215+ | 7 | 2026-06-27 | |||
| ISO7221CQDRQ1 | TI/德州仪器 | SOP8 | 10+ | 197 | 2026-06-27 | |||
| MAX3233ECWP | MAXIM/美信 | SOP | 2210+ | 77 | 2026-06-27 | |||
| UCC3750N | TI/德州仪器 | DIP28 | 08+ | 10 | 2026-06-27 | |||
| MAX3232IDW | TI/德州仪器 | SOP16 | 03+ | 45 | 2026-06-27 | |||
| GL850G | GENESYS/创惟科技 | QFN28 | 21+ | 15 | 2026-06-27 | |||
| LAN8720A-CP-TR | MICROCHIP/微芯 | QFN | 5 | 2026-06-27 | ||||
| AM26LS32AC | TI/德州仪器 | SOP16 | 2114+ | 60 | 2026-06-27 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K9F1G08U0D-SCB0 | SAMSUNG/三星 | 428+ | 6 | 2026-06-27 | ||||
| 93LC56B-E/SN | MICROCHIP/微芯 | SOP8 | 2217+ | 19 | 2026-06-27 | |||
| FW82443BX | INTEL/英特尔 | BGA | 0017+ | 1 | 2026-06-27 | |||
| VN340SP | ST/意法 | HSOP10 | 5 | 2026-06-27 | ||||
| NTS0104BQ | NXP/恩智浦 | QFN14 | 21+ | 5 | 2026-06-27 | |||
| MT29F16G08ABACAWP:C | MICRON/美光 | TSOP48 | 2242+ | 99 | 2026-06-27 | |||
| XCF16PVOG48C | XILINX/赛灵思 | TSOP48 | 2313+ | 3 | 2026-06-27 | |||
| MT29F16G08ABACAWP:C | MICRON/美光 | TSOP48 | 2324+ | 29 | 2026-06-27 |